Custom Microelectronic Assemblies provide solutions to many applications that cannot be achieved with standard packaged products. From basic miniaturised circuits to complex multi-function packages, Welwyn utilises substrates, interconnect and packaging technologies that bring the following advantages over competing discrete component systems: reduced footprints, improvements in thermal management, reliability durability, electrical & noise performance
- Ceramic
- Thick Film
- Metal Clad
- Photo-etch
- Steel
- Aluminium
- LTCC
- SMT
- Flipchip
- BGA
- Chip & Wire
- Thin Film
- PCB Assemblies
For further information on Microelectronic Applications please download as required.
